发明名称 |
Electric assembly with a wire-bonded circuit and method for manufacturing such an electric assembly |
摘要 |
<p>The assembly has two electrical conducting contact points (10, 20) that are arranged at a distance to each other. The contact points are electrically connected with each other via a wire connecting arrangement (30), which comprises two wire connections (31-1, 31-2), which consists of ends (32-1, 32-2, 33-1, 33-2). An end of a third wire connection exhibits a direct contact with an end of a fourth wire connection. A substrate section of a substrate arrangement (50) is electrically isolated in the area of the intermediate contacts. An independent claim is also included for a method for manufacturing an electrical arrangement.</p> |
申请公布号 |
EP1821341(A1) |
申请公布日期 |
2007.08.22 |
申请号 |
EP20070101947 |
申请日期 |
2007.02.08 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GOHLKE, SILVIA;KRAUS, SIEGLINDE;RAPPL, HANS;RAUSCHER, GUNTHER |
分类号 |
H01L21/603;H01L21/607;H01L25/065;H01L41/047 |
主分类号 |
H01L21/603 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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