发明名称 |
SPIN-ON PROTECTIVE COATINGS FOR WET-ETCH PROCESSING OF MICROELECTRONIC SUBSTRATES |
摘要 |
<p>New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.</p> |
申请公布号 |
EP1715961(A4) |
申请公布日期 |
2007.08.22 |
申请号 |
EP20050705442 |
申请日期 |
2005.01.07 |
申请人 |
BREWER SCIENCE, INC. |
发明人 |
LI, CHENGHONG;RUBEN, KIMBERLY, A.;FLAIM, TONY, D. |
分类号 |
B05D1/36;B32B9/04;B81C1/00;C09D125/12;H01L21/308;H01L21/311 |
主分类号 |
B05D1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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