| 摘要 |
A semiconductor package is provided to prevent cracks from being generated on a relatively weak solder resist by positioning a longitudinal corner of an adhesive tape on an upper portion of a Cu pattern. A semiconductor package includes a substrate(110) having a window(113) at a center portion, chips mounted on the substrate via an adhesive tape(120), a wire passing through the window for electrically connecting the substrate and the chip, and an epoxy molding compound sealing the chips and the wire to protect the wire. The adhesive tape is integrally attached to the substrate at both sides of the window. |
