Composite laminate circuit structure

摘要

A laminate circuit structure assembly is provided that comprises at least two modularized circuitized voltage plane subassemblies; optionally an interposer located between each of the subassemblies, and wherein the subassemblies and interposer, if present, are bonded together with a cured dielectric coating. The interposer comprises dielectric layers disposed about an internal electrically conductive layer.