发明名称 |
Integrated circuit with increased heat transfer |
摘要 |
A technique for improving the thermal power dissipation of an integrated circuit includes reducing the thermal resistivity of the integrated circuit by increasing heat transfer in vertical and/or lateral directions. These results are achieved by increasing the surface area of the backside and/or the surface area of the lateral sides of the integrated circuit die. In some embodiments of the invention, an integrated circuit includes circuit elements formed closer to a first surface of a semiconductor substrate than to a second surface of the semiconductor substrate. The semiconductor substrate has a varying profile that substantially increases the surface area of a thermal interface formed on the second surface as compared to the second surface being substantially planar. A maximum depth of the profile is less than the thickness of the semiconductor substrate.
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申请公布号 |
US7259458(B2) |
申请公布日期 |
2007.08.21 |
申请号 |
US20050050572 |
申请日期 |
2005.02.03 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SU MICHAEL ZHUOYING;EPPES DAVID HARRY |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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