| 摘要 |
A lead frame for improving warpage and a semiconductor package using the same are provided to minimize an empty space in a package body by forming a die pad to occupy the package body in 60 to 70 %. A die pad(112) has a chip mounting region on which a semiconductor chip(120) is mounted on a center portion thereof, and a boundary region(112b) positioned around the chip mounting region. Leads(114) are positioned on both sides of the die pad adjacent to the boundary region. Through-holes(113) are formed in the boundary region of the die pad in regular intervals. A width of the boundary region, in which the lead is positioned, is narrow, while a width of the boundary region, in which the lead is not positioned, is wide. |
