| 摘要 |
A polyimidesilicone resin is provided to obtain a resin having excellent heat resistance, chemical resistance, flexibility and insulation property and useful for producing a protective insulation film for a semiconductor device, a soldering protection film or a cover lay film. A polyimidesilicone resin comprises repeating units represented by the following chemical formula 1 and has a number average molecular weight of 5,000-200,000. In chemical formula 1, X is a tetravalent organic group, at least a part of which is a tetravalent group represented by the following chemical formula 2; and Y is a divalent organic group, at least a part of which has a phenolic hydroxyl group or aromatic carboxyl group. In chemical formula 2, R1 independently represents a C1-C8 monovalent hydrocarbon group; R2 independently represents a trivalent organic group; and n is a number, the average value of which is 1-120.
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