发明名称 Sample surface processing method
摘要 A surface processing method of a sample having a mask layer that does not contain carbon as a major component formed on a substance to be processed, the substance being a metal, semiconductor and insulator deposited on a silicon substrate, includes the steps of installing the sample on a sample board in a vacuum container, generating a plasma that consists of a mixture of halogen gas and adhesive gas inside the vacuum container, applying a radio frequency bias voltage having a frequency ranging from 200 kHz to 20 MHz on the sample board, and controlling a periodic on-off of the radio frequency bias voltage with an on-off control frequency ranging from 100 Hz to 10 kHz.
申请公布号 US7259104(B2) 申请公布日期 2007.08.21
申请号 US20030671608 申请日期 2003.09.29
申请人 HITACHI, LTD. 发明人 ONO TETSUO;TOKUNAGA TAKAFUMI;UMEZAWA TADASHI;YOSHIGAI MOTOHIKO;MIZUTANI TATSUMI;KURE TOKUO;KOJIMA MASAYUKI;SATO TAKASHI;GOTO YASUSHI
分类号 H01L21/302;B44C1/22;H01L21/3213 主分类号 H01L21/302
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