| 摘要 |
This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R<SUB>1 </SUB>is H, alkyl or the like, X is a crosslinking group represented by -C(R<SUB>2</SUB>R<SUB>3</SUB>)- or C(R<SUB>4</SUB>R<SUB>5</SUB>)-Ar-C(R<SUB>4</SUB>R<SUB>5</SUB>)- (wherein R<SUB>2</SUB>-R<SUB>5 </SUB>are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.
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