发明名称 Tailoring impedances of conductive traces in a circuit board
摘要 A multi-layer circuit board includes a first layer having at least first and second conductive traces of different widths and the same impedance. One of a first power plane and first ground plane has a void region such that the first conductive trace is spaced apart from the first power plane by a first thickness, and the second conductive trace is spaced apart from the first ground plane by a second, different thickness.
申请公布号 US7259968(B2) 申请公布日期 2007.08.21
申请号 US20030437619 申请日期 2003.05.14
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 WRIGHT MITCHEL E.
分类号 H05K1/11;H05K1/00;H05K1/02;H05K1/14 主分类号 H05K1/11
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