发明名称 |
Tailoring impedances of conductive traces in a circuit board |
摘要 |
A multi-layer circuit board includes a first layer having at least first and second conductive traces of different widths and the same impedance. One of a first power plane and first ground plane has a void region such that the first conductive trace is spaced apart from the first power plane by a first thickness, and the second conductive trace is spaced apart from the first ground plane by a second, different thickness.
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申请公布号 |
US7259968(B2) |
申请公布日期 |
2007.08.21 |
申请号 |
US20030437619 |
申请日期 |
2003.05.14 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
WRIGHT MITCHEL E. |
分类号 |
H05K1/11;H05K1/00;H05K1/02;H05K1/14 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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