发明名称 |
Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition |
摘要 |
In a photosensitive resin, a photoresist composition having the photosensitive resin, and a method of forming a photoresist pattern by using the photoresist, the photosensitive resin includes a blocking group substituted for an acid. The photosensitive resin has a weight-average molecular weight of from about 6,000 up to about 8,000. The photosensitive resin has a blocking ratio of from about 5% up to about 40%.
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申请公布号 |
US7258963(B2) |
申请公布日期 |
2007.08.21 |
申请号 |
US20060333934 |
申请日期 |
2006.01.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WANG YOUN-KYUNG;KIM KYOUNG-MI;KIM YOUNG-HO;KIM JAE-HYUN |
分类号 |
G03F7/039;G03F7/30 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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