发明名称 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition
摘要 In a photosensitive resin, a photoresist composition having the photosensitive resin, and a method of forming a photoresist pattern by using the photoresist, the photosensitive resin includes a blocking group substituted for an acid. The photosensitive resin has a weight-average molecular weight of from about 6,000 up to about 8,000. The photosensitive resin has a blocking ratio of from about 5% up to about 40%.
申请公布号 US7258963(B2) 申请公布日期 2007.08.21
申请号 US20060333934 申请日期 2006.01.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 WANG YOUN-KYUNG;KIM KYOUNG-MI;KIM YOUNG-HO;KIM JAE-HYUN
分类号 G03F7/039;G03F7/30 主分类号 G03F7/039
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