PRINTED CIRCUIT BOARD(PCB) HAVING RELIABLE BUMP INTERCONNECTION STRUCTURE AND FABRICATION METHOD, AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A PCB(Printed Circuit Board) and a manufacturing method thereof, and a semiconductor package using the same are provided to improve a bonding reliability between a second metal line layer and a bump using a reliable bump connection structure such as a rivet portion. A plurality of bumps(32) are formed on a first metal line layer(30). A resin layer(34) is formed on the first metal line layer in order to insulate the bumps from each other. The height of the resin layer is lower than those of the bumps, so that the bumps are protruded from the resin layer. A second metal line layer(36) is formed on the resin layer. The second metal line layer has an insertion hole corresponding to the bump. The second metal line layer is connected with the first metal line layer through the bump. The bump has a rivet portion(42) with a larger diameter than that of the insertion hole. The second metal line layer is reliably connected with the first metal line layer due to the rivet portion.