| 摘要 |
A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns such that an upper surface of the copper pattern is exposed. A plating layer is then applied to the exposed upper surface of the copper patterns. Protrusion of the plating layer at a lower portion of a copper pattern is prevented, thus reducing an interval between the wire bonding pad(s) and potentially increasing the number of bonding pads which may be effectively formed on a given PCB.
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