| 摘要 |
A circuitry sheet ( 322 ) comprising an electronic device layer stack ( 304 ) containing electronic devices, e.g., thin-film transistors, or portions thereof, formed by removing material from both sides of the device layer stack. The circuitry sheet may be made by an electronic/optoelectronic device manufacturing method ( 200 ) that includes the steps of forming the device layer stack on a temporary substrate ( 300 ), removing material from both sides of the device layer stack, and then attaching a permanent substrate ( 348 ) to the device layer stack. The method uses one or more resist layers ( 600 ) that may be activated simultaneously and independently to impart distinct circuit pattern images ( 603, 608, 612 ) into each of a plurality of image levels ( 612, 616, 620 ) within each resist layer, thereby obviating repetitive sequential exposure, registration and alignment steps.
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