METHOD FOR ATTACHING SOLDER BALL USING SOLDER BALL FIXING PLATE

摘要

A solder ball attaching method is provided to reduce a processing time by transferring quickly a solder ball and restraining the contamination of a solder ball attach tool due to the flux dotted on a ball land using a solder ball fixing plate. A solder ball fixing plate(110) is prepared. The solder ball fixing plate includes holes(112) corresponding to ball lands and solder balls(130) inserted into the holes. The solder ball fixing plate is adsorbed to a solder ball attach tool. The solder ball attach tool is transferred to an upper portion of a substrate. The solder ball attach tool is used for attaching the solder balls to the ball lands by separating the solder balls from the solder ball fixing plate. The solder ball fixing plate is made of a synthesized resin material.