| 摘要 |
A Pb-free solder composition which prevents oxidation of molten solder consistently and effectively, maintains conventional Pb-free soldering temperature and wettability, and can improve soldering adhesive property by containing Si and Co in a quinary Sn-Cu-Ag-Ni-Ge solder composition or a senary Sn-Cu-Ag-Ni-Ge-P solder composition, and an electronic equipment and a PCB using the same are provided. A Pb-free solder composition comprises 0.1 to 2 wt.% of copper, 0.1 to 4.0 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.5 wt.% of nickel, 0.001 to 0.1 wt.% of germanium, and the balance of tin. The Pb-free solder composition further comprises 0.001 to 0.2 wt.% of phosphorous. The Pb-free solder composition further comprises 0.001 to less than 0.01 wt.% of cobalt. As an electronic equipment comprising a plurality of electronic components adhered by a Pb-free solder alloy, the electronic equipment is characterized in that the Pb-free solder alloy comprises 0.1 to 2 wt.% of copper, 0.1 to 4.0 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.5 wt.% of nickel, 0.001 to 0.1 wt.% of germanium, and the balance of tin. As a PCB(printed circuit board) adhered by a Pb-free solder alloy, the PCB is characterized in that the Pb-free solder alloy comprises 0.1 to 2 wt.% of copper, 0.1 to 4.0 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.5 wt.% of nickel, 0.001 to 0.1 wt.% of germanium, and the balance of tin. |
