发明名称 WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
摘要 A circuit board and a manufacturing method thereof are provided to determine a present state of the circuit board, to secure high productivity and reduce fabrication costs. A circuit board(1) includes a base insulating layer, a conductor pattern on the base insulating layer, and a cover insulating layer for coating the conductor pattern on the base insulating layer. The conductor pattern includes a terminal portion(6) for being connected with an external terminal. The cover insulating layer includes an opening portion corresponding to the terminal portion. A position determining region is formed at a predetermined portion adjacent to the terminal portion in order to determine whether a peripheral portion of the cover insulating layer is located in proper position or not.
申请公布号 KR20070082038(A) 申请公布日期 2007.08.20
申请号 KR20070014871 申请日期 2007.02.13
申请人 NITTO DENKO CORPORATION 发明人 ICHIKAWA KAZUSHI;TAKAYOSHI YUICHI
分类号 H01L21/60;H05K1/09 主分类号 H01L21/60
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