| 摘要 |
<p>A method for manufacturing a semiconductor device is provided to stabilize conditions of following semiconductor manufacturing processes by removing repeated failure photoresist patterns from a semiconductor substrate using a failure pattern group capable of checking whether a photo process is performed or not. Pattern inspecting equipment is prepared, wherein the pattern inspecting equipment has at least one reference value satisfying a semiconductor photo process. A photomask is stably loaded in the pattern inspecting equipment(50). The photomask has a base plate, a protective layer on the base plate and photomask patterns between the base plate and the protective layer. A failure pattern group is detected from a peripheral portion of the photomask patterns by using the pattern inspecting equipment. The pattern inspecting equipment is capable of checking whether the semiconductor photo process is performed or not by comparing the sum of magnitudes of failure patterns with the reference value.</p> |
