发明名称 RELEASE FILM FOR PCB
摘要 A release film for a printed circuit board is provided to allow soft feature providing cushioning function and good release property capable of preventing a protective membrane from sticking to a compressor heating plate. A release film for a printed circuit board includes: a core layer located in the central part of the film, which is made of alpha-polyolefine copolymer with 150 ~ 210 micrometers of thickness and less 90 of shore A hardness; and skin layers formed on the both sides of the core layer, which is made of homo polypropylene with 20-50 micrometers of thickness and 160 ~ 165 deg.C of melting temperature.
申请公布号 KR100752354(B1) 申请公布日期 2007.08.20
申请号 KR20060083561 申请日期 2006.08.31
申请人 MEDIPACK CO., LTD. 发明人 LEE, SANG WOON;LEE, YOUNG SUN;YUN, EUNG JUN
分类号 B32B27/32;C08J5/18;H05K3/28 主分类号 B32B27/32
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