发明名称 |
RELEASE FILM FOR PCB |
摘要 |
A release film for a printed circuit board is provided to allow soft feature providing cushioning function and good release property capable of preventing a protective membrane from sticking to a compressor heating plate. A release film for a printed circuit board includes: a core layer located in the central part of the film, which is made of alpha-polyolefine copolymer with 150 ~ 210 micrometers of thickness and less 90 of shore A hardness; and skin layers formed on the both sides of the core layer, which is made of homo polypropylene with 20-50 micrometers of thickness and 160 ~ 165 deg.C of melting temperature.
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申请公布号 |
KR100752354(B1) |
申请公布日期 |
2007.08.20 |
申请号 |
KR20060083561 |
申请日期 |
2006.08.31 |
申请人 |
MEDIPACK CO., LTD. |
发明人 |
LEE, SANG WOON;LEE, YOUNG SUN;YUN, EUNG JUN |
分类号 |
B32B27/32;C08J5/18;H05K3/28 |
主分类号 |
B32B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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