摘要 |
A camera module package is provided to improve the assembling performance by forming a sensor protecting cap in the same shape as a bottom of a housing in a structure that the sensor protecting cap is closely combined with the bottom of the housing, and recycle an image sensor by removing direct bonding combination. An optical unit(20) includes a lens barrel(22) having at least one or more lens, and a housing(21) for mounting the lens barrel at an upper part. A sensor protecting cap(30) is mounted at a lower end of the optical unit and has a sensor securing part(31) at the center. A flexible printed circuit board(50) is inserted between the optical unit and the sensor protecting cap, and has an image sensor(40) combined with a bottom. The sensor protecting cap has at least two or more grooves(32) at a top side of each corner part for inserting combining protrusions(21a) protruded at a bottom of the housing.
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