DICING DIE ATTACH FILM AND SEMICONDUCTOR PACKAGING METHOD USING THE SAME

摘要

A dicing die attachment film and a method for packaging a semiconductor using the same are to prevent generation of burr and die flying during a dicing process, and to separate easily a die attachment layer from a dicing film layer from during a picking-up process. A die attachment layer(103) is attached to one surface of a semiconductor wafer. A dicing film layer(100) is attached to a dicing die that is used for cutting the semiconductor wafer into die units. An intermediate layer(102) is laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer. A change rate of a storage modulus of the intermediate layer is 0.001 to 1.