<p>An insulating material for a printed circuit board is provided to obtain an insulating material having excellent dielectric characteristics and showing a small change in the dielectric constant depending on variations in temperature. An insulating material for a printed circuit board comprises a liquid crystal resin and ceramic powder, has a temperature coefficient of capacitance(TCC) of -300 to +300 ppm/deg.C as measured at -55 to 125 deg.C, and shows a dielectric constant of 5-40. The insulating material has a tan delta of 0.01 or less. The ceramic powder has a chemical composition represented by the formula of (1-x)(CaTiO3).x(LaAlO3), wherein x is 0.001-0.5.</p>
申请公布号
KR100752019(B1)
申请公布日期
2007.08.17
申请号
KR20060095758
申请日期
2006.09.29
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, JIN CHEOL;OH, JUN ROK;KIM, TAE KYOUNG;YOON, SANG JUN;LEE, HWA YOUNG