发明名称 INSULATING MATERIAL FOR PRINTED CIRCUIT BOARD
摘要 <p>An insulating material for a printed circuit board is provided to obtain an insulating material having excellent dielectric characteristics and showing a small change in the dielectric constant depending on variations in temperature. An insulating material for a printed circuit board comprises a liquid crystal resin and ceramic powder, has a temperature coefficient of capacitance(TCC) of -300 to +300 ppm/deg.C as measured at -55 to 125 deg.C, and shows a dielectric constant of 5-40. The insulating material has a tan delta of 0.01 or less. The ceramic powder has a chemical composition represented by the formula of (1-x)(CaTiO3).x(LaAlO3), wherein x is 0.001-0.5.</p>
申请公布号 KR100752019(B1) 申请公布日期 2007.08.17
申请号 KR20060095758 申请日期 2006.09.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JIN CHEOL;OH, JUN ROK;KIM, TAE KYOUNG;YOON, SANG JUN;LEE, HWA YOUNG
分类号 C04B35/71;H05K3/00 主分类号 C04B35/71
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