METHOD OF MEASURING A PATTERN ALIGNING STATE

摘要

A method for measuring a pattern alignment state is provided to check exactly an alignment state distribution of the pattern formed on a semiconductor substrate by checking the substrate according to corresponding regions using an in-line SEM(Scanning Electron Microscope). A substrate is prepared(S100). The substrate includes a lower pattern and an upper pattern. The upper pattern is electrically connected with the lower pattern. An alignment state of the upper pattern is checked by using an in-line SEM on the lower pattern(S110). The lower pattern and the upper pattern are made of a conductive material.