An apparatus and a method for cutting a substrate are provided to reduce the operation time for cutting a mother substrate and forming a unit cell substrate by successively performing first and second cutting processes through first and second cutting units. A first cutting unit(300) cuts a mother substrate including a first substrate and a second substrate into a plurality of stick type substrates. A second cutting unit cuts the stick type substrates into a plurality of unit cell substrates. A first loading unit(200) is connected to one side of the first cutting unit and loads the mother substrate to the first cutting unit. A second loading unit(400) is connected to other side of the first cutting unit and one side of the second cutting unit. The second loading unit loads the stick type substrates passing through the first cutting unit into the second cutting unit.
