发明名称 CHIP-TYPE PASSIVE DEVICE
摘要 A chip-type passive device is provided to implement high mounting density by increasing the number of passive devices mounted on the same circuit board. A chip-type passive device includes a body(110), and an external electrode(120). The body(110) has a rectangular parallelepiped shape. The external electrode(120) is formed at the body(110), and includes a first part(121) and a second part(122). The first part(121) is formed at a first side(111) of the body(110). The second part(122) is formed on at least one second side(112). The first part(121) has a larger size than the first side(111).
申请公布号 KR20070081537(A) 申请公布日期 2007.08.17
申请号 KR20060013498 申请日期 2006.02.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YU, KWANG SU;HAN, SEONG CHAN;BANG, HYO JAE;LEE, DONG CHUN
分类号 H01G4/40 主分类号 H01G4/40
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