A chip-type passive device is provided to implement high mounting density by increasing the number of passive devices mounted on the same circuit board. A chip-type passive device includes a body(110), and an external electrode(120). The body(110) has a rectangular parallelepiped shape. The external electrode(120) is formed at the body(110), and includes a first part(121) and a second part(122). The first part(121) is formed at a first side(111) of the body(110). The second part(122) is formed on at least one second side(112). The first part(121) has a larger size than the first side(111).
申请公布号
KR20070081537(A)
申请公布日期
2007.08.17
申请号
KR20060013498
申请日期
2006.02.13
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
YU, KWANG SU;HAN, SEONG CHAN;BANG, HYO JAE;LEE, DONG CHUN