| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a conductor electrode and a ribbon wire on a glass substrate together inexpensively, surely and rigidly without causing any damage. <P>SOLUTION: On the exposed portion of an Mo metallic back surface electrode layer 4B formed on a glass substrate 4A, an In solder coated copper foil ribbon wire 1 is mounted where the one side of a copper foil or a tin plated copper foil 2 having a thickness of 300 μm or less or the surface other than the one side is coated with In solder 3 (In 100-90%, Ag 10-0%) having a thickness of 100 μm, and then an ultrasonic solder iron 5 is applied against the upper surface of the copper foil ribbon wire 1 in order to melt the In solder 3, thus connecting the copper foil ribbon wire 1 to the electrode layer 4B. Alternatively, the In solder 3 (above-mentioned composition) is previously soldered to the electrode layer 4B, a ribbon copper foil or a tin plated copper foil 2 is mounted thereon, and then the copper foil 2 is connected to the electrode layer 4B by means of the ultrasonic solder iron 5. <P>COPYRIGHT: (C)2007,JPO&INPIT |
