发明名称 INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit which can improve yield and reliability. SOLUTION: The integrated circuit 100 is provided with a semi-insulating semiconductor substrate 11; an insulating film 12 formed on the semi-insulating substrate 11; and a capacitor that is comprised of a lower electrode 14 formed on the insulating film 12, an insulating film 15 formed on the lower electrode 14, and an upper electrode 16 formed on the insulating film 15. In this case, a connection part 20 for the lower electrode 14 and the semi-insulating semiconductor substrate 11 is provided so that the lower electrode 14 and the semi-insulating semiconductor substrate 11 may be in contact with each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007207817(A) 申请公布日期 2007.08.16
申请号 JP20060022015 申请日期 2006.01.31
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 YAMANE YASUAKI;MAKIMURA TAKASHI;TOKUMITSU MASAMI;ENOKI TAKATOMO
分类号 H01L21/822;H01L21/768;H01L23/522;H01L27/04 主分类号 H01L21/822
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