PRINTED CIRCUIT, METHOD OF MANUFACTURING THE PRINTED CIRCUIT, PRINTED CIRCUIT/ELECTRONIC ELEMENT ASSEMBLY, AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT/ELECTRONIC ELEMENT ASSEMBLY

摘要

Provided is a printed circuit. The printed circuit includes a base layer, a plurality of bonding pads formed on the base layer, and an insulation barrier formed between the bonding pads. The insulation barrier prevents a short circuit caused by whisker growth on solder portions electrically connecting the bonding pads to bonding portions of an electronic element.