ABRASIVE PAD AND ABRASION DEVICE

摘要

An abrasive pad used for forming a flat surface on a glass, a semiconductor, a dielectric/metal complex, an integrated circuit, or the like, in which a scratch is hard to occur on the surface of a substrate, the abrasion state can be optically measured well during abrasion, and whether uniform abrasion is achieved over the entire surface of a material abraded or not can be checked. An abrasion device is also provided. The abrasive pad is provided with a through hole interconnecting the abrasion side and the back side at a position passing the center of a wafer during abrasion. End of the through hole close to the center of the abrasive pad is located at a distance of 35% or more of the radius from the center of the abrasive pad, the length of the through hole in the direction to the center of the abrasive pad is not longer than the length in the direction perpendicular to the center of the abrasive pad, the length of the through hole in the direction to the center of the abrasive pad is equal to 10% of the radius or less, and the length in the direction perpendicular to the center of the abrasive pad is equal to 12.5% of the radius or less.