发明名称 RELEASABLE RESIN COMPOSITION, MOLDED ARTICLE AND LAMINATE THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide a releasable resin composition which excels in thermal stability at extrusion molding or the like, does not cause problems such as fuming and foaming at the time of compounding or extrusion molding, does not stain a metal roll, and further at the time of coming in contact with an adhesive layer, can form a releasing layer free from a problem of deterioration of adhesive characteristic due to migration of impurities from the releasing layer. SOLUTION: This releasable resin composition comprises a releasing agent (A) comprising, as a principal component, a polymer compound having a weight-average molecular weight of 10,000-1,000,000 bearing 8-30C aliphatic groups and a thermoplastic polymer (B) comprising, as a constituting unit, an olefin monomer and/or a polar monomer, where the content of the releasing agent (A) is 0.1-20 pts.wt. per 100 pts.wt. of the thermoplastic polymer (B). The releasing agent (A) is one whose 2% weight-reduction temperature is in a region of 260°C or higher but lower than 275°C and whose 5% weight-reduction temperature is in a region of 275°C or higher but lower than 330°C both by a thermogravimetric analysis. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007204640(A) 申请公布日期 2007.08.16
申请号 JP20060025992 申请日期 2006.02.02
申请人 MITSUBISHI CHEMICALS CORP;NITTO DENKO CORP 发明人 SAITO MASANORI;KANAI SHINICHIRO;SEKI MOTOHIRO;YAMAMOTO SATOSHI;HANAKI KAZUYASU;HAYASHI KEIJI;OKUMURA KAZUTO
分类号 C08L23/00;B32B27/00;B32B27/28;C08L23/36 主分类号 C08L23/00
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