发明名称 |
ONE-PART TYPE HEAT CURABLE COMPOSITION |
摘要 |
<p>To provide a one-part type heat curable composition which exhibits superior adhesion properties, is easily cured by heating, does not soften even if the composition is baked at increased temperature, is completely cured by means of moisture in the atmosphere even if curing is not sufficient due to heating temperature, heating period, and the like, and exhibits increased adhesiveness with respect to a coating film after the composition is cured. A one-part type heat curable composition comprising: (A) a prepolymer having a urethane bond(s), and an isocyanate group (s) at a chain end or pendent position (s) thereof; (B) an amine-adduct type latent hardener; and (C) a moisture latent hardener.</p> |
申请公布号 |
WO2007090875(A1) |
申请公布日期 |
2007.08.16 |
申请号 |
WO2007EP51238 |
申请日期 |
2007.02.09 |
申请人 |
SIKA TECHNOLOGY AG;SASAKI, TOSHIHIDE;SUGIYAMA, AKIRA |
发明人 |
SASAKI, TOSHIHIDE;SUGIYAMA, AKIRA |
分类号 |
C09K3/10;C08G18/10;C09J175/04 |
主分类号 |
C09K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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