METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING SUBSTRATE AND SEMICONDUCTOR PACKAGE

摘要

A substrate for a semiconductor mounting and a method for manufacturing a semiconductor package are provided to easily release heat to a lower substrate and to prevent pop corn phenomenon by using a blind via hole formed insulating layers on both sides of a metal plate. A clearance hole is formed on a metal plate(300) for electrically connecting a semiconductor to a lower substrate. Insulating layers(310,317) are laminated on both sides of the metal plate to gap-fill the clearance hole with an insulating material. A through hole(313) is formed to pass through the clearance hole. A blind via hole(315) is formed on the insulating layers to correspond to a region on which the semiconductor is mounted. The though hole and the blind via hole are gap-filled with a conductive material. A circuit pattern is formed on a layer including the conductive material. A thermally conductive adhesive layer is formed on an upper portion of the blind via hole and a connection metal is formed on an upper portion of the through hole, thereby manufacturing a substrate for a semiconductor mounting. The connection metal is coupled to a first connection terminal of a flip-chip semiconductor. The thermally conductive adhesive layer is laminated to be coupled to a second connection terminal of the flip-chip semiconductor.