| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyamic acid ester composition capable of shortening processing time in a development step in the production of a relief pattern and having high resolution and storage stability. <P>SOLUTION: The photosensitive resin composition comprises (a) 100 pts.mass of a polyamic acid ester having a repeating unit represented by formula (1), (b) 1-20 pts.mass of a photopolymerization initiator and (c) 30-600 pts.mass of an organic solvent, wherein a content of N-ethyl-2-pyrrolidone and/or 1,3-dimethyl-2-imidazolidinone in the organic solvent is ≥50 mass% of the total amount of the organic solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
