| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a planarization method of a substrate which can increase productivity per unit time of an extremely thin semiconductor substrate with no warping by reducing a use amount of a protection adhesive tape by half when planarizing the semiconductor substrate. <P>SOLUTION: A pair of semiconductor substrates 2 are bonded at their the electronic circuit planes using a warm water soluble adhesive 3 to form a semiconductor substrate/the warm water soluble adhesive/a semiconductor substrate laminate 1. Front and rear faces of the laminate 1 are ground, washed, polished, and washed. Thereafter, the planarized laminate 1 is dipped in warm water at 60-90°C, and the warm water soluble adhesive 3 is dissolved to separate the laminate 1 into two extremely thin semiconductor substrates 2 each having a thickness of 20-50 μm. Instead of the warm water soluble adhesive 3, an adhesive 3 which disappears by heating may be used, and the polished and ground laminate 1 is heated to 150-170°C to be separated into the two extremely thin semiconductor substrates 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
