| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent damage of a semiconductor chip (3) while reducing heat generation. <P>SOLUTION: A lead electrode (4) includes a header (14) having a plane area enlarged as compared with the plane area of a semiconductor chip (3), and a flange (16) extending downward from the periphery (14a) of the header (14) toward the base (11a) for forming a recess (11). The flange (16) can lessen mechanical stress transmitted to the semiconductor chip (3) through a resin coating (5). On the other hand, heat generated from the semiconductor chip (3) can be absorbed by the flange (16), and can be transmitted from the flange (16) to the sidewall (22) before being dissipated to the outside of a semiconductor device through a supporting electrode (1). <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
