| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board capable of fully implementing an AC coupling treatment function on the multilayer printed-wiring board where AC coupling treatment takes place for a transmission signal from a sender's transmission line to a receiver's transmission line. SOLUTION: In this multilayer printed-wiring board 1, a distance up to a first plane layer 2 from a transmitter's transmission line 101 and a receiver's transmission line 102 is 0.25 mm or less, the first plane layer 2 has a punching part 6 at a location just below electrode pads 103, 104 and chip capacitor 105, and the punching part 6 causes a distance up to a second plane layer 3 from the electrode pads 103 and 104 to be 0.5 mm or more. COPYRIGHT: (C)2007,JPO&INPIT |
