| 摘要 |
PROBLEM TO BE SOLVED: To provide a means which can realize a small and thin resin-sealed type semiconductor device with good productivity, when a semiconductor element is highly integrated, and has multiple pins, even when the number of inner lead portions is large. SOLUTION: A terminal land frame, comprising a plurality of land structures 12 so formed as to protrude above a frame main body 10, is connected to the frame main body 10 with a thin part 11, with a groove part 13 provided on the upper surface of the land structure body 12, while a protruding part 14 is formed on the lower surface. In the land structure body 12, the thin part 11 is broken and separated under the pressing force in the protruding direction from the frame main body 10. Thus, the reliability in resin sealing is provided at configuration of a semiconductor device, efficiently providing a small resin-sealed type semiconductor device where land electrodes are arrayed on the bottom surface. COPYRIGHT: (C)2007,JPO&INPIT
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