发明名称 CONDUCTIVE PASTE AND METHOD OF MANUFACTURING CONDUCTIVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste excellent in adhering property to a base material, capable of obtaining high conductivity even if dried in low temperature, and a method of manufacturing a conductive circuit having small electric resistance, suitable for an electric circuit. SOLUTION: The conductive paste contains a resin component containing butyral resin and vinyl chloride-vinyl acetate copolymer resin, silver powder, and organic solvent. The manufacturing method of the conductive circuit comprises a pattern forming process forming a pattern by printing or painting the conductive paste on the base material, and a drying process drying the pattern. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007207567(A) 申请公布日期 2007.08.16
申请号 JP20060024779 申请日期 2006.02.01
申请人 FUJIKURA KASEI CO LTD 发明人 HONDA TOSHIYUKI;SASAMURA SATORU;OKAMOTO KOJI
分类号 H01B1/22;H01B13/00;H05K1/09;H05K3/12 主分类号 H01B1/22
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