| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for processing substrate using a laser lithography by which the formation and adjustment of a pattern with superior accuracy of a large substrate, and further three-dimensional uniformity of the pattern are obtained, and the total substrate processing work period is shortened by providing both a film-forming part and a patterning part, and manufacturing cost can be reduced by reducing the entire foot print of the substrate processing device. SOLUTION: This device comprises the film-forming part for forming a thin film on a substrate, and a laser lithographic part for forming a specified pattern on the thin film. Alternatively, the device comprises a coat part for applying the thin film on the substrate, and the laser lithographic part for forming the specified pattern on the thin film. The substrate processing method comprises a step for providing the substrate, a step for forming the thin film on the substrate, and a step for patterning the thin film in the same device by using a laser. COPYRIGHT: (C)2007,JPO&INPIT
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