发明名称 HIGH TURNABLE FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which has a high turnable property and is also excellent in a dimension stability, and to provide a method of manufacturing the flexible printed wiring board. SOLUTION: In the flexible printed wiring board with a cover ray, a side of forming a metallic circuit of the flexible printed wiring board wherein a metal wiring pattern is formed on a base film through an adhesive layer is protected by a cover ray film. Both the base film and the cover ray film are formed of a polyimide film whose elastic modulus is less than 5 GPa; and the base film, the adhesive layer, metal wiring, and the cover ray are constituted so that a stiffness value of the flexible printed wiring board with the cover ray in a remaining metallic ratio of 50% may become 12 g/cm or less. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007208087(A) 申请公布日期 2007.08.16
申请号 JP20060026569 申请日期 2006.02.03
申请人 KANEKA CORP 发明人 KANESHIRO NAGAYASU;KIKUCHI TAKESHI;FUJIMOTO SHOGO
分类号 H05K1/02;H05K1/03;H05K3/28 主分类号 H05K1/02
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