发明名称 |
Heat dissipating apparatus having micro-structure layer and method of fabricating the same |
摘要 |
The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.
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申请公布号 |
US2007187074(A1) |
申请公布日期 |
2007.08.16 |
申请号 |
US20070785325 |
申请日期 |
2007.04.17 |
申请人 |
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发明人 |
YEH LAN-KAI;LIN CHE-WEI;TSAI MING-JYE;CHEN SHAO-WEN;SHYU JIN-CHERNG |
分类号 |
F28F13/18;F28D15/02;F28D15/04;H01L23/427;H05K7/20 |
主分类号 |
F28F13/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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