| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method capable of easily exfoliating mask material for plating without affecting such a pattern as a metal pattern in any way, and also capable of reusing the mask material for plating. SOLUTION: The pattern forming method comprises: a step of forming a thick film resist pattern by carrying out pattern formation to the thick film resist mold where thick film resist is applied on a substrate so as to be used as a thick film resist mold; a step of forming a PDMS sheet by hardening the prepolymer mixed solution of PDMS poured on the thick film resist pattern; and a step of sticking the PDMS sheet on another substrate by having the sheet exfoliated from the substrate and thick film resist pattern. Before pouring and hardening the prepolymer mixed solution of PDMS, it is made to perform pressure processing for forming a via hole. COPYRIGHT: (C)2007,JPO&INPIT |
