| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin, excellent in a high curing property and preservation stability, and an epoxy resin composition containing the same and an adhesive material, an electroconductive material, an insulation material, a sealing material, a coating material, a coating composition, a prepreg, a structural adhesive, a heat conductive material, etc., giving high joint reliability and a high sealing property of the obtained epoxy resin composition even under curing conditions such as a low temperature or in a short time. SOLUTION: This epoxy resin curing agent is characterized by having ≥0.05 pt.mass and ≤3 pts.mass water content in the curing agent for the epoxy resin based on 100 pts.mass curing agent for the epoxy resin, and also containing >3 and ≤10 pts.mass solvent (S) inactive to the amine adduct (A) based on 100 pts.mass (C) the curing agent for the epoxy resin. The microencapsulated curing agent for the epoxy resin obtained by microencapsulating the above curing agent for the epoxy resin and the epoxy resin composition containing the same are also provided. COPYRIGHT: (C)2007,JPO&INPIT
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