| 摘要 |
A printed circuit board according to the present invention is a printed circuit board ( 4 ) including a component mounting pin ( 1 ) made of a metal wire to connect with a semiconductor chip ( 10 ). The semiconductor chip ( 10 ) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin ( 1 ) is formed by using wire-bonding technology. This printed circuit board ( 4 ) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip ( 10 ) and the printed circuit board ( 4 ).
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