PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of producing a heat resistant relief structure and having high sensitivity, and a method for producing a semiconductor device using the composition.

SOLUTION: The positive photosensitive resin composition contains a polybenzoxazole precursor having a group containing -SO2NH- at a terminal and a photosensitizer.

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