| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a defective bump junction resulting from the warp of a printed-wiring board when a large-sized chip is reflow-mounted in the thinned printed-wiring board. SOLUTION: In a method for mounting the printed-wiring board, the printed-wiring board is held between a hold-down plate and a carrier plate for inhibiting the warp in the case of a reflow heating, at a time when the chip is loaded on the printed-wiring board and the warp is inhibited by a pressing by a holding plate. In the mounting method, the printed-wiring board is held and solder-mounted to the hold-down plate with an opening having an external shape larger than that of the printed-wiring board and being larger than the mounted chip and a holder with the carrier plate and the champ. COPYRIGHT: (C)2007,JPO&INPIT |
