| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor with excellent adhesiveness to a lead frame and excellent resistance to soldering, and a process for its production. SOLUTION: A combination of a fused curing agent and a triazinethiol compound shown by a general formula (1) at a particular ratio is fused and mixed to give a fused mixture. Then, the fused mixture is combined and kneaded with an epoxy resin (A component) and an inorganic filler (C component) to give the epoxy resin composition for sealing of the semiconductor. Thus, the epoxy resin composition for sealing of the semiconductor containing the epoxy resin (A component), a fused mixture (B component) of the above mentioned curing agent and the triazinethiol shown by the general formula (1) and the inorganic filler (C component). COPYRIGHT: (C)2007,JPO&INPIT
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