| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting or radiation-curable diepoxyfluorene compound negative to Ames test and having low melting point, high solubility in solvent, etc., and good handling property compared with conventional epoxy resin having bisphenolfluorene-type skeleton and provide a method for producing the compound and a composition containing the compound. SOLUTION: The diepoxyfluorene compound is expressed by general formula (1) (R is hydrogen atom or methyl group; and n is an integer of 0-10). COPYRIGHT: (C)2007,JPO&INPIT
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