发明名称 |
REMOVAL OF SILICA BASED ETCH RESIDUE USING AQUEOUS CHEMISTRY |
摘要 |
Removal of silica-based etch residue is effected by use of an aqueous chemistry which eliminates hazard concerns in connection with electronic component fabrication tooling. The system employs a formulated product comprising a controlled level of ionized fluorine in a citrate buffer containing a dual surfactant system for etch residue penetration and rinsing. The combined system is proven to be ideal for Si-based etch residue dissolution and removal. The Si-residue removal rates have been characterized at specific buffered pH values and normal process conditions at times between 45 sec. to 3 min., and with those described being effectual at times of the order of 45 sec. or less when processed in a single-wafer tool. The product simplifies and reduces cost time and materials.
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申请公布号 |
US2007191243(A1) |
申请公布日期 |
2007.08.16 |
申请号 |
US20060307556 |
申请日期 |
2006.02.13 |
申请人 |
GENERAL CHEMICAL PERFORMANCE PRODUCTS, LLC |
发明人 |
MOORE JOHN C. |
分类号 |
C11D7/32 |
主分类号 |
C11D7/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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