COOLING DEVICE OF UNION YTPE FOR SEMICONDUCTOR MODULE

摘要

A built-in cooling apparatus of a semiconductor module is provided to effectively radiate the heat generated from semiconductor modules by using a heat sink and a cooling unit installed in the heat sink wherein the heat sink includes attach parts coupled to each semiconductor module and a connection part for interconnecting all the attach parts. A cooling apparatus is mounted on a plurality of semiconductor modules(50) installed in parallel with a mother board. A heat sink(65) has a similar size to that of the semiconductor module, including a plurality of attach parts(62) coupled to one or both surfaces of the semiconductor modules and a connection part(64) for interconnecting all the upper parts of the attach part. A cooling unit radiates the heat transferred from the semiconductor module to the outside, installed in one of the upper or the lateral surface of the heat sink. A heat conductive material(68) with adhesion is interposed between the attach part and the semiconductor module.